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Fresh off a successful funding round, this well-capitalized (Series B) start-up is pioneering a new category of high-resolution perception sensing technology for ADAS and autonomous driving.

Seeking a Packaging Engineer to lead the development and execution of advanced IC packaging solutions. This is a high-impact role with broad ownership across design, integration, and vendor collaboration.

Responsibilities

• Lead the design of advanced IC packaging including 2.5D/3D integration, Flip-Chip, RFIC, and System-in-Package (SiP) technologies.
• Collaborate with RFIC, mechanical, and system teams to co-optimize packaging for thermal, mechanical, and electrical performance.
• Perform thermal and mechanical simulations using tools such as ANSYS (stress, warpage, delamination, etc.).
• Drive material selection, design-for-manufacturing (DFM), and reliability evaluations aligned with automotive-grade standards.
• Interface directly with OSATs and substrate suppliers to manage package development from concept to production.
• Create and review mechanical drawings, package stack-ups, and layout constraints.
• Lead failure analysis and root cause investigations for packaging and reliability issues.
• Influence the overall packaging roadmap and help scale product development for automotive qualification.

Key Qualifications

• 10+ years of hands-on experience in IC package design and development
• Proven expertise in IC packaging for RFIC, SoC, or millimeter-wave/THz systems.
• Strong understanding of mechanical stress, thermal modeling, and reliability analysis.
• Hands-on experience with Flip-Chip, Fan-Out, 2.5D/3D interposers, or heterogeneous integration.
• Experience working cross-functionally with RF, system, PCB, and mechanical design teams.
• Familiarity with packaging materials, substrate design, and automotive reliability standards (e.g., AEC-Q).
• Excellent communicator and independent problem-solver.
• Comfortable working in a start-up environment with a high degree of autonomy.
• Education: M.S. or Ph.D. in Mechanical Engineering, Materials Science, or a related field.

Location

Hybrid working from any of the company offices:

• Bay Area CA
• New Haven CT

Seniority level

• Seniority level

  Mid-Senior level

Employment type

• Employment type

  Full-time

Job function

• Job function

  Engineering, Science, and Project Management

• Industries

  Semiconductor Manufacturing, Motor Vehicle Manufacturing, and Appliances, Electrical, and Electronics Manufacturing

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