VP, Advanced Packaging Technology
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The Group You’ll Be A Part Of
In the Global Products Group, we are dedicated to excellence in the design and engineering of Lam's etch and deposition products. We drive innovation to ensure our cutting-edge solutions are helping to solve the biggest challenges in the semiconductor industry.
The Group You’ll Be A Part Of
In the Global Products Group, we are dedicated to excellence in the design and engineering of Lam's etch and deposition products. We drive innovation to ensure our cutting-edge solutions are helping to solve the biggest challenges in the semiconductor industry.
The Impact You’ll Make
Technology leadership position for the Advanced Packaging business group to provide insights and direction on Advanced Packaging technology trends and their implications for Lam’s product portfolio. Provides leadership for external eco-system engagements that support next generation advanced packaging technology development.
What You’ll Do
AP technology strategy & roadmap
Establish and implement a comprehensive technology roadmap for advanced packaging solutions, aligning with market trends, customer requirements, and industry megatrends (e.g., AI, 3DIC, hybrid bonding, panel-level packaging)
Product development & engineering
Work closely with product teams to guide the development of advanced packaging solutions
Ensure products meet performance, reliability, and cost targets, addressing customer needs and market competitiveness
Customer engagement
Engage with and understand customers’ technology roadmaps and challenges, provide insightful perspectives that influence customers roadmaps, oversee co-development efforts
Strategic partnership & ecosystem engagement
Ownership for academic institutions, and industry consortia relationships and Lam sponsored programs
Represent the company at industry events, conferences, and panels to promote technological leadership
Preferred Qualifications
Leadership role in the Semiconductor industry, with a focus on advanced packaging technologies and FE/BE process integration
Deep engagement with Tier-1 end customers (e.g., foundry, IDM, memory players), and proven success in fab/equipment company leadership, ideally within the packaging domain
Expertise in hybrid bonding, with demonstrated impact from a fab operations, design enablement, or equipment innovation perspective
Proven track record of leading the development and commercialization of advanced packaging solutions, from concept through HVM
Extensive ecosystem influence, including active participation in industry consortia, strategic partnerships, and global customer engagements requiring significant travel
Recognized as an industry thought leader, with a history of shaping technology roadmaps and presenting at major conferences
Our Commitment
We believe it is important for every person to feel valued, included, and empowered to achieve their full potential. By bringing unique individuals and viewpoints together, we achieve extraordinary results.
Lam Research ("Lam" or the "Company") is an equal opportunity employer. Lam is committed to and reaffirms support of equal opportunity in employment and non-discrimination in employment policies, practices and procedures on the basis of race, religious creed, color, national origin, ancestry, physical disability, mental disability, medical condition, genetic information, marital status, sex (including pregnancy, childbirth and related medical conditions), gender, gender identity, gender expression, age, sexual orientation, or military and veteran status or any other category protected by applicable federal, state, or local laws. It is the Company's intention to comply with all applicable laws and regulations. Company policy prohibits unlawful discrimination against applicants or employees.
Lam offers a variety of work location models based on the needs of each role. Our hybrid roles combine the benefits of on-site collaboration with colleagues and the flexibility to work remotely and fall into two categories – On-site Flex and Virtual Flex. ‘On-site Flex’ you’ll work 3+ days per week on-site at a Lam or customer/supplier location, with the opportunity to work remotely for the balance of the week. ‘Virtual Flex’ you’ll work 1-2 days per week on-site at a Lam or customer/supplier location, and remotely the rest of the time.
Salary
CA San Francisco Bay Area Salary Range for this position: - .
The above salary range for this position is relevant to applicants that reside or work onsite in the California, San Francisco Bay Area only. Salary offers will depend on factors that include the location you work from, your level, education, training, specific skills, years of experience and comparison to other employees already in this role. Actual salary may vary from salary offered due to numerous factors including but not limited to unpaid time off, unpaid leave, company mandated shutdown, and other relevant factors.
Our Perks And Benefits
At Lam, our people make amazing things possible. That’s why we invest in you throughout the phases of your life with a comprehensive set of outstanding benefits.
IND123
GLD2017
Seniority level Seniority level Not Applicable
Employment type Employment type Full-time
Job function Job function Other
Industries Semiconductor Manufacturing
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- Location:
- Fremont, CA, United States
- Salary:
- $200,000 - $250,000
- Job Type:
- FullTime
- Category:
- IT & Technology, Engineering